• It provides comprehensive wafer fabrication services and technologies to semiconductor supplier and system companies.

    提供了全面半导体晶圆制造服务技术供应商系统公司

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  • These vendor functions must be integrated for functions such as wafer fabrication, wafer test, module build, and module test.

    这些供应商功能必须针对制造、晶片测试模块构建模块测试功能进行集成

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  • Using virtual wafer fabrication technique, different structures of high voltage LDMOS's are analyzed and compared, and optimized structures are obtained.

    采用虚拟制造技术分析比较多种结构对器件结构进行了优化

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  • ESD is an issue not only for finished products but also during their manufacture, from wafer fabrication to packaging to the assembly of complete systems.

    ESD 的问题不仅对于成品来说很重要,在制造过程中晶圆程、封装组装整个系统)也是重要的课题。

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  • Wafer fabrication is one of the most complex and high competence manufacturing. How to fully utilize the machine capacity to meet customer demand is a very important topic.

    晶圆制造为现今复杂高度竞争制造环境之一,因此,充分利用现有产能满足顾客需求相当重要的课题。

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  • SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.

    基于三种不同规模半导体生产线模型非批加工设备使用不同调度规则的情况下,对提出的SRB进行了仿真验证

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  • According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.

    针对半导体晶圆制造系统瓶颈设备动态漂移特性提出一种动态瓶颈实时策略

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  • once the company is happy with the design of a wafer fabrication plant, it willcopy it exactly” in its other locations, says Professor Hargadon, “down to the paint on the wall.

    一旦公司对某家生产工厂设计表示满意一个地点“照样复制”,格顿教授,“一直具体墙壁涂料”。

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  • A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.

    基于智能技术,提出芯片制造生产线动态调度方法,实现了投料调度、工件调度设备维护调度的集成

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  • Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.

    介绍了晶圆键合工艺技术要求应用选择以及MEMS作用展示了MEMS制造技术应用前景

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  • Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.

    太阳能硅片制造工艺主要包括硅片的切割以及绒面制备两部分。

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  • The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication.

    现有技术传声器典型地要求制造过程中于硅片表面进行一种二次机加工操作

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  • The model of the Boron ion spread in wafer was analyzed by numerical simulation and the micro resistor fabrication conditions were optimized.

    通过数值计算,建立了制备过程硅基底中的离子空间浓度分布理论模型,优化了二次硼扩散工艺条件

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  • A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.

    种在半导体制造改善晶圆图案化特征结构临界尺寸均匀性方法

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  • The fabrication techniques with dissolved wafer process of sensitive element are expressed.

    叙述敏感元件的体溶解薄片法制造工艺

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  • Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.

    完成整体结构圆片级真空封装的同时,通过线腔结构方便地实现了中间电极的引线

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  • Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.

    完成整体结构圆片级真空封装同时通过线腔结构方便实现了中间电极的引线

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  • After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.

    通过半导体加工工艺分析研究提出了磨料射流切割半导体材料,包括晶圆的切割、芯片的终端封装切割。

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  • After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.

    通过半导体加工工艺分析研究提出了磨料射流切割半导体材料,包括晶圆的切割、芯片的终端封装切割。

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