They can be classified into wafer level, chip level, and package level stacking.
它们可以分为圆片级封装、芯片级封装、和封装面。
This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.
文章论述了超csptm圆片级封装技术工艺。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
Other typical low current measurements on wafer level semiconductors are related to the dielectric, either the oxide or compound quality.
另一些对于晶圆片级半导体的弱电流测量则通常与介电材料(氧化物或化合物)的质量有关。
This paper introduces the background of using Wafer Level Reliability technology, and expounds the characteristics and functions in details.
介绍了圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.
本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。
Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.
在完成整体结构圆片级真空封装的同时通过引线腔结构方便地实现了中间电极的引线。
The prober is necessary role in wafer-level analysis of reliability.
在晶圆形式可靠度分析中，承载晶圆的探针台是不可或缺的。
The structure may have less complex focusing, reduced crosstalk, tighter pixel packing density, increased quantum efficiency, and wafer-level packaging.
所述结构可具有较不复杂的聚焦、减小的串扰、较紧密的像素组装密度、提高的量子效率及晶 片级封装。
The etch-stop phenomenon as a result of galvanic cell formation is verified by the wafer-level chip and the separated electrodes experiments.
用分立电极实验和芯片级实验验证了原电池钝化引起的腐蚀自停止现象。
The invention relates to a wafer-level lens module and a manufacturing method thereof.
一种晶圆级镜头模组及其制造方法。
Wafer-level, laser-trimmed, thin-film resistors and temperature-compensated NMOS switches assure operation over the full operating temperature range with exceptional lin- ear and gain stability.
晶圆级，激光微调，薄膜电阻和温度，真实姿态补偿NMOS管开关保证在整个工作温度和特殊林耳和经营范围的增益稳定性。
Wafer-level, laser-trimmed, thin-film resistors and temperature-compensated NMOS switches assure operation over the full operating temperature range with exceptional lin- ear and gain stability.
晶圆级，激光微调，薄膜电阻和温度，真实姿态补偿NMOS管开关保证在整个工作温度和特殊林耳和经营范围的增益稳定性。
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