半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
利用一化学机械研磨制程，移除该氧化 物层的部分区域，以使该填满沟槽的氧化物层与该第一多晶硅层大体上齐平。
Through a CMP process, portions of the oxide layer are removed to substantially planarize the trench-filled oxide layer as the first polysilicon layer.
分析了W -CMP的机理，抛光液对W材料表面具有化学腐蚀和机械研磨的双重作用，对抛光速率有着重要的影响。
The mechanism of W-CMP was analyzed, the slurry makes a dual function of chemical erosion and mechanical lapping, has an important influence on the polishing rate.
研究了重晶石在搅拌磨湿法超细研磨过程中产生的机械力化学效应。
The mechanochemical effect of barite particles is studied during the wet ultrafine grinding by using stirred mill.
研究了重晶石在搅拌磨湿法超细研磨过程中产生的机械力化学效应。
The mechanochemical effect of barite particles is studied during the wet ultrafine grinding by using stirred mill.
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