低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
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