晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
制造集成电路需要将如半导体和金属等多层材料放置在硅片上。
Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.
再加上新型轻质材料、集成电子技术和空气动力学方面的进步，我们已经可以看到提高燃油效率有效技术途径。
Add in the new lightweight materials, integrated electronics, aerodynamic advances, and right there is a technology road map that increases fuel efficiency.
本文将提供很好的阅读材料，即使您刚刚开始学习JMS集成。
This article provides good reading material even if you are just starting to learn the steps involved with JMS integration.
在单片集成光路中，必须在单一材料中获得全部的光学功能。
In monolithic integrated optics, all optical functions must be obtained in a single material.
结束阶段的任务包括集成，系统测试，用户文档，培训材料和市场营销材料的准备。
Integration, system test, user documentation, training material preparation, and marketing material preparation are among closure tasks.
该系统的应用实现了管道从原材料选择到最终控制缠绕生产的一体化集成。
The application of this system has realized the integration of the whole production course from the selection of raw materials to winding machine control.
数字逻辑门电路作为集成电路被制造：所有组成的晶体管和电阻建立在一块半导体材料上。
Digital logic gate circuits are manufactured as integrated circuits: all the constituent transistors and resistors built on a single piece of semiconductor material.
集成电路，一小片内含相互连接的微缩电路的半导体材料。
INTEGRATED circuit, a small piece of semiconductive material that contains interconnected miniaturized electronic circuits.
它的广泛报导集中在印刷电路、集成电路、连接材料、半导体、导线、粘结、钎焊、焊锡和焊接。
Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.
工业工程与技术专业主要学习运用科学和数学原理，来设计、改善和安装人，材料，信息和能源的集成系统。
This curriculum trains participants to apply scientific and mathematical principles to the design. improvement. and installation of integrated systems of people. material. information. and energy.
塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。
First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.
用各种颜色的小块材料如石块、玻璃、瓷片、贝壳等紧密地拼集成各种图案的装饰工艺。
Surface decoration of small coloured components-such as stone, glass, tile, or shell-closely set into an adhesive ground.
分析了成膜材料的组成及杂质元素等对集成电路性能的影响。
The influences of the composition of film material and the impurity elements on the performance of integrated circuit are discussed.
所谓集成就是把电路中的所有元件同时制作在单片材料上。
This integration is achieved by the simultaneous fabrication, on a single piece of material, of all components of a circuit.
以硅基光电集成回路为主线，综述了不同的硅基光波导材料的制备技术和硅基光波导的制作工艺及其对光传输损耗的影响。
In this paper different silicon-based materials of optical waveguide and its loss characteristics are introduced, with focus on silicon-based optic electronics integrated circuit (OEIC).
引线框架用铜带是集成电路的重要基础材料。
The copper alloy strip of lead frame is the fundamental material for integrate circuit.
这些材料的组合方式决定了集成电路的特性和功能。
The manner in which these materials are put together determines the characteristics and function of the IC's.
集成组件是形成了从由注塑聚合材料。
The integrated component is formed from a polymerizable material by injection molding.
主要用于微电子行业，被广泛应用于半导体器件、集成电路等分装材料。
It is mainly used in microelectronic Industry. Widely used for the encapsulant of semiconductors and integrated circuits.
由于用GMR材料制成的集成化传感器存在较高的巴克·豪森噪声，影响了集成化传感器系统的分辨率和稳定性、限制了它的应用。
However, there is high Barkhausen noise in the integration sensor making by GMR materials, it affect the resolution ratio and stability of integration sensor, and imprison its applications.
光电子信息材料是本世纪最受关注的材料之一，光电子集成器件在信息时代有极其重要的作用。
The material of optoelectronic information is one of the extremely greatest concerns of the material. Optoelectronic integrated devices take the most important effect.
本系统是传感器技术、计算机技术、仪器仪表技术为一体的系统的集成和自动化技术在材料制备领域的应用。
The monitoring system integrate sensor technology computer technology and instrument technology. It is automation technology applying in material manufacture field.
本文在大量材料收集的基础上，经过认真的分析选择，整体集成，得出了学习技术系统体系结构领域知识。
In the base of a lot of material, through careful analysis and selection, comprehensive integration, we achieve the domain knowledge of Learning Technology Architecture.
多级有序沸石材料能有效地实现多级孔和多活性位的集成，在催化和功能材料领域有重要的应用前景。
Hierarchically ordered zeolite materials could effectively realize integration of multi-model pores and active sites, which had promising applications in fields of functional materials and catalysis.
该方法根据实测的客观物理量集成运用有限元方法和优化技术来测算材料的弹性参数。
The experimental results were used to calculate material properties, using the finite element method combined with optimization techniques.
硅基发光材料是光电子集成的基础材料。
Si-based light-emitting materials are fundamental in optoelectronic integration.
硅基发光材料是光电子集成的基础材料。
Si-based light-emitting materials are fundamental in optoelectronic integration.
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