本文着重从银粉的粒度、添加量和固化剂的种类、用量以及固化条件等方面研究和探讨了环氧-低分子聚酰胺-银粉导电胶体系的导电性及强度。
In this paper the effect of size of silver particles, proportion, curing agent and curing condition on epoxy resin - low - molecular polyamide - silver particles system are studied and discussed.
本文着重从银粉的粒度、添加量和固化剂的种类、用量以及固化条件等方面研究和探讨了环氧-低分子聚酰胺-银粉导电胶体系的导电性及强度。
In this paper the effect of size of silver particles, proportion, curing agent and curing condition on epoxy resin - low - molecular polyamide - silver particles system are studied and discussed.
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