The bonding of anti-irradiating coverglass is the important point in the manufacturing process of space solar cell array.
抗辐照玻璃盖片的封装操作是空间太阳能电池方阵制造过程的重要环节。
"It's a primal social bonding process," he added. "We're looking at the roots of empathy."
“这是一种主要的社会关系过程“他最后补充到，”我们还在研究移情作用的本质。”
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
The shape of the concrete bonding surface is very irregular usually, and its measured data by fractional dimension device is a stochastic process.
通常混凝土粘结面的形状极不规则，其表面的分维仪测值是一随机过程。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
New mothers are awash in oxytocin (which is involved in the labor process), and it is believed that the hormone promotes bonding between mother and infant.
女性在生产和哺乳过程中也会大量分泌后叶催产素——它能增进母亲和婴儿之间的感情。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
The paper studied the reaction mechanism of self bonding in dry process binderless fiberboard manufacture by investigating the chemical composition and conversion of wood.
通过干法无胶纤维板制造过程中对木材化学成分的转化和含量变化的研究，探讨了干法无胶纤维板的粘合机理。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
Matthew: Brushing is a actually obviously been epical for him and it's a bonding, part of the bonding process.
马修：很显然，这种梳理对它大有裨益，同时也是我们建立良好关系的一部分。
To accelerate the manufacturing process for the 400 square metre facade, we had to develop an automated process for applying the two-component bonding agent.
为了加速400平米立面建造进程，我们不得不研发一种适用于双组份黏合剂的自动化工序。
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.
在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
Families who cook at home not only save money but tend to have healthier eating habits and even share some family bonding time in the process as they prepare the meal together.
谁的家庭在家里做饭，不仅省钱，往往有健康的饮食习惯，甚至有一些共同的家庭在这个过程中结合时间，他们准备一起吃饭。
The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.
器件键合失效主要表现为温度试验后管壳上的键合点脱落，而引起失效的原因与工艺过程和键合所涉及的材料有关。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
Psychology lays a foundation for the action process of emotional bonding.
情感担保的作用过程有其心理学基础。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
Some double crystal rocking curves of photocathode epitaxy materials and substrates are measured by means of X-ray double crystal diffraction in the bonding process.
用X射线双晶衍射仪测量了阴极和玻璃热粘结工艺过程中阴极材料外延层和衬底的双晶回摆曲线。
The model and the simulation results can be the reference in design of bonding process.
这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
The clad metal sheet has been produced by a proprietary roll bonding process.
这种金属复合板是采用特殊的轧制复合工艺加工而成的。
By using the improved bonding process, the reliability of the detector can be enhanced greatly.
改进后的焊接工艺可大幅提高探测器的可靠性。
Based on the elastic-plastic FE theory, the Punching Bonding process of the automobile sheets is simulated by using ANSYS analysis software in this paper.
采用有限元分析软件ANSYS，基于弹塑性有限元理论建立有限元模型，对汽车板件冲压连接过程进行了模拟。
According to the present invention, defects of traditional wafer bonding process can be avoided.
本发明可避免传统晶片粘合工艺的缺点。
The technological requirement and bonding process for SC and SD type of cylindrical sleeves were introduced.
介绍了SC型和SD型筒形砂套技术要求及制作工艺。
Based on the experimental results, the models of the ultrasonic wedge bonding process and the interfacial bonding characteristics were illustrated.
给出了超声楔形键合接合过程和界面特征的模型。
Earlier aluminum frames used a bonding process that glued the tube into a lug.
此前使用的铝框粘合胶过程的管成耳。
The characteristics of bonding force in the ultrasonic bonding process were also studied.
在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。
Flexible epoxy bonding or soft adhesive bonding is preferred to the packaging process.
在包装过程中最好使用柔性环氧黏合或软黏胶性结合。
The optimum bonding process was given.
确定了最佳粘接工艺。
The optimum bonding process was given.
确定了最佳粘接工艺。
应用推荐