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A new method for measuring bonding strength between electroplated layer and substrate of diamond tool is proposed.
提出一种新的电镀金刚石工具镀层与基体结合强度测试方法。
youdao
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A new method for measuring bonding strength between electroplated layer and substrate of diamond tool is proposed.
提出一种新的电镀金刚石工具镀层与基体结合强度测试方法。
youdao