• The effect of pulse frequency and pulse duration ratio on the abrasion resistance of gold coatings is investigated with pulse plating in cyanide free and trace cyanide baths.

    研究了脉冲电镀镀金氰镀金体系中脉冲频率、脉冲占空比对镀金耐磨性影响

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  • The applicable fields of alkaline cyanide-free zinc plating and acidic zinc plating before trivalent chromium passivation were proposed.

    提出应用三价钝化碱性镀锌酸性镀锌的适用场合。

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  • The progress in the study of cyanide-free copper electroplating on steel matrix is introduced according to different valences of copper in the deposition process.

    按照沉积过程不同对在钢铁基体无氰碱性镀铜的研究进展进行了说明。

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  • The application of cyanide-free zinc plating processes to large-sized and shape-complicated workpiece was introduced.

    介绍了无氰镀锌工艺尺寸、形状复杂工件上应用

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  • Ten typical formulas and some kinds of additives used for cyanide-free silver plating were introduced.

    综述了种典型工艺配方无氰镀银所采用添加剂类型

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  • The exploratory experiment of cyanide-free separating technology of lead-zinc in the slime for a concentration plant had been carried out.

    某选矿厂矿泥铅锌分离工艺进行探索研究。

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  • The quality of nickel deposit is an important indicator to test the performance of cyanide-free zincating solution for high-Si aluminum alloy.

    镍层质量检验无氰高硅铝合金浸性能重要手段。

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  • The process of cyanide-free silver pulse electroplating is investigated in 5,5-dimethyl hydantoin(DMH) bath.

    研究5,5-二甲基乙内酰脲(DMH)无脉冲工艺

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  • Through experimental study, the CIP plant of Hougou Gold Mine brought the technology of normal pressure cyanide free desorption into being without any modification of original equipment.

    金矿炭浆经过试验研究使用原有设备,进行任何改动,实现常压解吸

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  • Through adding assistant complexing agent and controlling initial current density, cathodic polarization was intensified in cyanide-free electrolyte.

    通过添加辅助络合控制起始电流密度的方法,可以增强氰电镀时阴极极化

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  • JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.

    本文介绍了国内无研究情况,部分翻译了日本专利特开2000-192279,介绍银及其合金无氰电镀液组分及工艺,镀液比较稳定

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  • JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.

    本文介绍了国内无研究情况,部分翻译了日本专利特开2000-192279,介绍银及其合金无氰电镀液组分及工艺,镀液比较稳定

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