• The gold plating liquid may contain water.

    镀金可以包含

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  • For protecting PCB in the process of gold plating.

    适用于镀金过程保护印刷电路板

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  • A low cyanide bright 22k gold plating process was investigated.

    研究一种氰电镀光亮22K工艺

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  • Silvering and gold plating is a traditional decoration technology.

    金银中国传统装饰工艺之一。

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  • Is the tape test performed to make sure the adhesion of gold plating?

    是否胶带测试确保镀金附着力

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  • Ensure that developers aren't "gold plating" (adding features beyond the requirements).

    确保开发人员不会镀金”(增加超出需求特性)。

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  • The plating material cna be substituted for gold plating and silver plating to become...

    镀层材料代替镀金,成为良好的弱电接点材料。

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  • The process of wear was from adhesive to abrasive, the gold plating was worn out at last.

    磨损过程为先粘结再擦伤,最后镀金穿。

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  • Timeboxes serve as the perfect hedge against perfectionism, gold plating and procrastination.

    时间盒可以很好地防止完美主义、画蛇添足拖延。

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  • Porosity is one of the important factors to evaluate the quality of gold plating on connectors.

    微孔率评价连接器镀金质量重要参数之一

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  • Two dangling stars, one in Silver Shade crystal and the other in gold plating, add extra sparkle.

    分别垂挂着银色魅影水晶星星金色星星。

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  • Consequently neutral nickel, bright copper, bright nickel and decorative gold plating were applied.

    随后电镀中性光亮、光亮镍镀金。

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  • All too often, projects undergo the "gold plating" process long after deadlines and success conditions are determined.

    很多时候项目经历镀金”的过程,期限已经过期很久成功条件得以明确。

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  • Watch gold plating is generally used stainless steel plating techniques, so it has rarely been found in this case.

    现在钟表镀金普遍采用不锈钢电镀技巧因此已经很少发现这种情形了。

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  • The Oscar statuettes, officially dubbed the Academy Award of Merit, have a 24-karat gold plating on their surface.

    被正式称为学院奖奥斯卡小雕像表面层24k黄金

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  • Some aspects that need to be deeply studied on electroless gold plating for engineering plastics were put forward.

    提出塑料表面镀金工艺深入研究几个方面

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  • The present paper deals with the bath for hard gold plating, the quantity controll and the wear mechanism of coatings as well.

    简要论述电子工业中接插件镀层耐磨机理,获得硬金镀层镀液,节金代金以及镀金质量检测等问题。

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  • The technology not only can be applied to the gold plating of all kinds of printed circuit board, but also can be used to pro…

    用于各式印刷线路板镀金作为电子产品自催化化学镀厚前的顶覆金层。

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  • Pierced earrings with 3 interlinking rings in rhodium, gold and rose-gold plating; 2 rings set with Golden Shadow and clear crystals.

    穿耳环3相连,黄金和玫瑰金2金色影子清晰晶体

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  • This habit is about finding the balance between doing enough error handling and not doing so much gold plating that your code is never finished.

    一习惯要求编写足够错误处理代码不是编写对付所有错误的代码,以致代码迟迟不能完成。

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  • Existing growing device has shortcomings that gold plating is not convenient, plating layer is not uniform, and crystal growth has great stress.

    现有生长装置存在镀金方便镀层均匀晶体生长应力等弊端。

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  • We provide the service of polishing, cleaning, gold plating and white plating etc, Customers can take your old jewelry to our store and fresh it new.

    本店提供抛光清洗黄、白金服务客人可以自己首饰带来本店翻新,使您的旧首饰焕然一新

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  • At the same time, we should think of the factors and natural conditions of use, function and corrosion mechanism and anticorrosive problem of gold plating.

    同时应该考虑镀层表面的使用条件、使用环境、功能腐蚀机理抗腐蚀性保护等具体问题

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  • The process formula of acid bright copper plating, acid bright nickel plating, (silver) plating and various colour gold plating on fresh flowers were presented.

    给出了鲜花酸性光亮、酸性光亮镀、镀以及各种彩色工艺配方

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  • Post-CMOS processes including electroless gold plating and special package technique are implemented to enhance the biocompatibility and stability of the biosensor.

    标准CMOS工艺基础上,应用无电浸镀金改进传感电极的生物兼容性采用特殊封装技术提高芯片在溶液环境中的稳定性

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  • Our Gold plating Division is specialized in the connectors or pin's plating for mobile phones, PC, digital cameras, cars, etc. The metal piece could be copper or s.

    公司镀金分厂主要从事手机电脑数码相机汽车设备的电子接插件连接件功能性电镀

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  • The optimized immersion gold plating bath contains an organic additive which can slow down initiatory deposition rate, result in a slow dissolution of Ni-P substrate.

    工艺含有能够减缓镀金初始时沉积速率,又能降低对镍层腐蚀添加剂

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  • After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).

    研究了甲基异丁基酮(MIBK)萃取分离电感耦合等离子体原子发射光谱法(ICP AES)测定镀金杂质元素的新方法。

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  • After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).

    研究了甲基异丁基酮(MIBK)萃取分离电感耦合等离子体原子发射光谱法(ICP AES)测定镀金杂质元素的新方法。

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