The power generating element is used in such a state that the battery element is externally wrapped by a laminated film or the battery element is stored in the external case.
功率产生元件在电池元件被层叠膜从外部包裹或电池元件容纳在外壳中的状态下使用。
The protector (200) has recesses (210 and 220) for accommodating those wrinkles (92) of the aluminum-laminated film (90), which are formed at the corners of the electrochemical element (100).
保护器(200)具有用于容纳铝复合膜(90)的那些褶皱(92)的凹槽(210和220)，所述褶皱在电化学元件(100)的拐角处形成。
The laminated, chemically resistant, self-adhesive code strip is manufactured from silicone-free polyester film and stored on reels in lengths of up to 100 meters.
经过层压，抗化学腐蚀的不干胶码带是由有机硅无聚酯薄膜制造而成，以长达100米的卷轴方式存放。
The hot melt adhesive was extruded into film by an extruder and then was laminated hotly with crosslinking polyethylene flat and glass fibre net with large holes so the fixing flat was obtained.
用挤出机将其挤成胶膜后与交联聚乙烯基材，大孔径玻璃纤维网热复合制成固定片。
The XIR laminated glass is a new kind of glass that joins a transparent XIR heat-reflection film between two pieces of PVB, and then let the film heat bonding with two- piece of glass.
XIR夹层节能玻璃是在两片PVB之间加入一张透明的XIR热反射薄膜，再与两片玻璃热合而成的一种新型夹层节能玻璃。
Ian film Foshan co., Ltd. is a company specialized in smart glass, construction EVA laminated safety glass film development, production and sales of high-tech enterprises.
佛山市依恩胶片科技有限公司是一家专业从事智能玻璃、建筑工程安全玻璃EVA夹层胶片的研发、生产及销售的高新技术企业。
The invention relates to an elastic laminated product and a manufacture art. The elastic laminated product is composed of a layer of elastic film and at least one layer of spunbonded nonwoven cloth.
本发明涉及一种弹性层压制品及其制造工艺，该弹性层压制品由一层弹性膜和至少一层纺粘非织造布层构成。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
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