Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅。
From the main cause lead to this problem this essay give a maybe solution to it through using supplementary hole in explosion.
本文从大块发生的主要因素出发，通过实验采用辅助孔爆破方法取得了良好的效果。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
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