Used for engraving glass, cleaning residue on the sand casting, controlled fermentation, power semiconductor wafer polishing and cleaning corrosion (with HNO3 mixed acid).
用于雕刻玻璃、清洗铸件上的残砂、控制发酵、电抛光和清洗腐蚀半导体硅片(与HNO3的混酸)。
Used for engraving glass, cleaning residue on the sand casting, controlled fermentation, power semiconductor wafer polishing and cleaning corrosion (with HNO3 mixed acid).
用于雕刻玻璃、清洗铸件上的残砂、控制发酵、电抛光和清洗腐蚀半导体硅片(与HNO3的混酸)。
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