At present, pure tin deposit has a bad solder reliability, tin-based binary alloy deposits have big brittleness or bad wettability, and noble metal deposits have high price.
目前，纯锡镀层的焊接可靠性差，锡基二元合金镀层有脆性大、润湿性差等方面的问题，贵金属镀层成本高。
At present, pure tin deposit has a bad solder reliability, tin-based binary alloy deposits have big brittleness or bad wettability, and noble metal deposits have high price.
目前，纯锡镀层的焊接可靠性差，锡基二元合金镀层有脆性大、润湿性差等方面的问题，贵金属镀层成本高。
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