In this example the type is fanout.

在这个例子中类型是fanout。

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1D- panel level fanout low cost multi-die small form factor packaging;

1D-板级扇出低成本的多晶片小外形封装；

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1D- panel level fanout low cost multi-die small form factor packaging;

1D-板级扇出低成本的多晶片小外形封装；

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