Content and methods of shop-floor control in semiconductor wafer fabricati…
本文介绍了半导体晶圆制造车间层控制的内容及方法。
It takes around 13 cubic metres of freshwater to produce a single 200mm semiconductor wafer, for example.
例如，制造出一块2分米长的半导体晶片需消耗13立方米的水。
We present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes.
本文描述了使用共面微波探针的半导体芯片在片测试技术。
Both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips.
这两种芯片都是先在一张半导体薄片上成批生产，然后再切割成一个个芯片的。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。
Applicable scope: semiconductor wafer, optical glass, horologe parts, glasses, jewelry, polyester filtering cores, etc.
适用范围：半导体硅片，光学玻璃，钟表件，眼镜，珠宝首饰，涤纶过滤芯等。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
Based on the classification on the scheduling for semiconductor wafer lines, the modular and reconfigurable framework is proposed.
在分析半导体生产线调度分类的基础上，提出了组件化可重构半导体生产线调度体系结构。
Semiconductor wafer manufacturing: batch, semi-automated 25-wafer, single or dual chamber chemical stripping, developing and cleaning tool.
我公司再生产喷雾溶剂工具：半自动化，25晶圆，单或双室化学剥离，研发及清洁工具。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Semiconductor wafer processing. Single or dual chamber, 25-wafer batch processing offers high-performance wafer cleaning, rinsing and drying.
半导体晶片处理。单或双室，25晶圆批量处理提供高晶片清洁，冲洗和脱水功能。
The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
该半导体晶片上形成的一层互连膜与绝缘膜的可靠性可以在加速条件下加以评估。
By adopting the method of the embodiment of the invention, the stability and the production efficiency of the produced semiconductor wafer can be improved.
采用本发明实施例的方法能够提高生产的半导体晶圆的稳定性和生产的效率。
Used for engraving glass, cleaning residue on the sand casting, controlled fermentation, power semiconductor wafer polishing and cleaning corrosion (with HNO3 mixed acid).
用于雕刻玻璃、清洗铸件上的残砂、控制发酵、电抛光和清洗腐蚀半导体硅片(与HNO3的混酸)。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.
基于智能体技术，提出了芯片制造生产线动态调度新方法，实现了投料调度、工件调度与设备维护调度的集成。
It provides comprehensive wafer fabrication services and technologies to semiconductor supplier and system companies.
它提供了全面的半导体晶圆制造服务、技术供应商和系统公司。
This market research report covers the 2008 silicon wafer reclaim for the semiconductor market and provides a forecast to 2011.
该市场调研报告涵盖了2008年半导体市场的硅片回收状况以及对于2011年的预测。
The invention relates to a wafer clamp for an ion implanter which belongs to the field of semiconductor equipment manufacture.
本发明涉及一种离子注入机用的晶片夹，属于半导体装备制造领域。
Further growth of continuous compound semiconductor thick films (15) or wafer is achieved by epitaxial lateral overgrowth using HVPE.
通过使用HVPE的外延横向过生长实现连续的化合物半导体厚膜(15)或晶片的进一步的生长。
A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
一种在半导体与罩幕制造中改善晶圆上的图案化特征结构的临界尺寸均匀性的方法。
Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.
化学机械抛光(CMP)在半导体工业内获得了广泛的赞同，对控制形貌起伏的硅片表面当作首选方法。
Computer chip: or chip; integrated circuit or small wafer of semiconductor material embedded with integrated circuitry, comprises the processing and memory units of the modern digital computer.
芯片：集成电路或嵌入集成电路的小而薄的半导体，包含现代数字计算机的处理和记忆装置。
Quantum Wafer Inc. is a semiconductor optoelectronic materials and devices company. It is located in the heart of Zhujiang Delta Industry Area of China.
量晶光电是一家高科技企业，主业为半导体光电材料和器件，位于广东珠江三角洲中心地带。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
Provided is a method for manufacturing a semiconductor light emitting element, by which a sapphire wafer can be divided into chips accurately at an extremely high yield.
本发明提供一种半导体发光元件的制造方法，使蓝宝石晶片形成芯片时，能够以极高的成品率正确地形成芯片。
The micro machinery commonly is formed by a semiconductor substrate such as a silicon wafer.
微机械一般使用半导体衬底比如硅晶片形成。
The micro machinery commonly is formed by a semiconductor substrate such as a silicon wafer.
微机械一般使用半导体衬底比如硅晶片形成。
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