In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
在过去的两年中，伊智主要为200mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
Measures have been discussed for preventing the Al film for being pierced through by the probe in wafer probing on the 1034 Wafer prober.
本文打算在1034探针台上针对如何避免探针扎穿铝层问题作一讨论。
Of the three, Electroglas continues to be the only company focused on wafer probing technology and remains the technology leader in this segment.
值得一提的是，伊智公司是三者之中，惟一一家始终致力于晶圆探针技术研究的公司，并保持在该领域处于技术领先地位。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
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