Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent.
用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。
Effects of time, order of adding reagents, contents of ethanediol, silver nitrate, acid copper plating bath and nitrate on scattering intensity of resonance light were studied.
讨论了乙二醇用量、硝酸银用量、酸性镀铜液(底液)用量、硝酸用量、时间及试剂加入顺序对共振光散射强度的影响。
The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process.
硫酸盐光亮酸性镀铜，由于工艺的某些特殊性，对电镀设备要求很高。
The absorption curves of the brightener UBAC 1a of bright acid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.
通过实验分别测定了酸性镀铜光亮剂ubac1a和镀液中硫酸铜的吸收曲线。
The absorption curves of the brightener UBAC 1a of bright acid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.
通过实验分别测定了酸性镀铜光亮剂ubac1a和镀液中硫酸铜的吸收曲线。
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