Are the ambient conditions controlled for the bonding process?
周围是情况吗受约束的为会接程序？
The clad metal sheet has been produced by a proprietary roll bonding process.
这种金属复合板是采用特殊的轧制复合工艺加工而成的。
Earlier aluminum frames used a bonding process that glued the tube into a lug.
此前使用的铝框粘合胶过程的管成耳。
"It's a primal social bonding process," he added. "We're looking at the roots of empathy."
“这是一种主要的社会关系过程“他最后补充到，”我们还在研究移情作用的本质。”
The characteristics of bonding force in the ultrasonic bonding process were also studied.
在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。
In the bonding process, the substrate and the temperature mainly effect the thermal stress.
在健合工艺中，基板和健合温度主要影响到热应力的大小。
By using the improved bonding process, the reliability of the detector can be enhanced greatly.
改进后的焊接工艺可大幅提高探测器的可靠性。
According to the present invention, defects of traditional wafer bonding process can be avoided.
本发明可避免传统晶片粘合工艺的缺点。
We will do whatever we can to help customers solve the problems they encounter in bonding process.
帮助客户解决在粘合上产生的各种问题。
The paper summarized the application and bonding process of adhesive and sealant in bus manufacture.
密封胶在大客车中的应用和施工工艺进行了综述。
Bonding process of cold forming with ply pressure is introduced, and compared with hot-press approach.
介绍了叠压冷成型粘结法，且与热压法进行对比。
The technological requirement and bonding process for SC and SD type of cylindrical sleeves were introduced.
介绍了SC型和SD型筒形砂套技术要求及制作工艺。
Matthew: Brushing is a actually obviously been epical for him and it's a bonding, part of the bonding process.
马修：很显然，这种梳理对它大有裨益，同时也是我们建立良好关系的一部分。
Laser localized bonding is an important technology to reduce the high temperature adverse effect in bonding process.
激光局部键合是有效降低键合温度的一种重要工艺。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
In this paper, research results and disadvantages of main bonding process of zircaloy and stainless steel are reviewed.
分析了核反应堆用锆合金与不锈钢主要连接技术的研究结果及存在的问题。
Fanfiction has further romanticized this by including telepathy or the sharing of memories etc. as part of the bonding process.
同人小说使它更加浪漫化，比如说成心灵感应或记忆共存什么的。这似乎是“联系”的部分表现。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
Based on the experimental results, the models of the ultrasonic wedge bonding process and the interfacial bonding characteristics were illustrated.
给出了超声楔形键合接合过程和界面特征的模型。
Based on the elastic-plastic FE theory, the Punching Bonding process of the automobile sheets is simulated by using ANSYS analysis software in this paper.
采用有限元分析软件ANSYS，基于弹塑性有限元理论建立有限元模型，对汽车板件冲压连接过程进行了模拟。
Research showed that: during the transient liquid phase diffusion bonding process, there exists a critical value about the choice of the bonding pressure.
研究表明：瞬时液相扩散连接中，压力的施加降低了液相的最大宽度，同时降低了降熔元素的总量，可以减少完成等温凝固所需要的时间。
Some double crystal rocking curves of photocathode epitaxy materials and substrates are measured by means of X-ray double crystal diffraction in the bonding process.
用X射线双晶衍射仪测量了阴极和玻璃热粘结工艺过程中阴极材料外延层和衬底的双晶回摆曲线。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Statistical process control (SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
采用统计过程控制(SPC)技术，提高微电路产品的质量和可靠性，监控键合工序的生产过程状态。
The successful bonding process flow divides into five stages with temperature increasing. Surface energy value calculated based on the model is in agreement with the experimental results.
首次提出五阶段键合模型计算值与实测表面能曲线相一致，初步确定了键合过程中界面发生的微观反应机理。
The direct bonding joint between cemented carbide and nodular cast iron and the indirect bonding joint by using nickel foil as intermediate layer were obtained by HIP diffusion bonding process.
用热等静压扩散连接法获得了硬质合金与球墨铸铁的直接连接接头和以镍箔为中间夹层的间接连接接头。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
The influences of surface treatments, the pressures during bonding process and the thickness of adhesive layer on shearing strength were investigated with epoxy resin-DDS curing system as adhesive.
采用环氧树脂-DDS固化体系作为胶接剂，探讨了各种金属表面处理方法、胶接时对胶接面施加的压力、胶层厚度等因素对胶接剪切强度的影响。
The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.
器件键合失效主要表现为温度试验后管壳上的键合点脱落，而引起失效的原因与工艺过程和键合所涉及的材料有关。
The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.
器件键合失效主要表现为温度试验后管壳上的键合点脱落，而引起失效的原因与工艺过程和键合所涉及的材料有关。
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