Special importance were attached to the design and calculation of deposition chamber, vacuum system, sample system, sputtering cathode and control system.
作为重点，对真空室、真空系统、工件架、磁控溅射靶、控制系统等进行了相应的设计分析和计算。
Special importance were attached to the design and calculation of deposition chamber, vacuum system, sample system, sputtering cathode and control system.
作为重点，对真空室、真空系统、工件架、磁控溅射靶、控制系统等进行了相应的设计分析和计算。
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