This study developed a view factor model to simulate the physical vapor deposition of copper interconnect in low pressure conditions using cylindrical targets.
研究开发了一个角系数模型来模拟低气压下圆柱靶溅射沉积铜连线。
This study developed a view factor model to simulate the physical vapor deposition of copper interconnect in low pressure conditions using cylindrical targets.
研究开发了一个角系数模型来模拟低气压下圆柱靶溅射沉积铜连线。
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