The mechanism of electroless plating tin was investigated from displacement process and reduction process.
对化学镀锡的机理从置换过程和还原过程两个方面进行研究。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
The effects of the composition and controlled conditions of electroless tin plating on the morphology of coatings are investigated.
研究了化学镀锡溶液组成和工艺条件对镀层表面形貌的影响。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
Semi-automatic rolling copper, nickel, silver, zinc, tin, etc. and electroless nickel plating.
半自动滚镀铜、镍、银、锌、锡及无电解镀镍等。
The research tendency and developing prospect of electroless tin plating are also discussed.
同时对化学镀锡的研究方向和发展趋势进行展望。
Besides, deposition rate of electroless tin also increases with increasing plating time.
若继续升高镀液温度，沉积速率却降低。
Besides, deposition rate of electroless tin also increases with increasing plating time.
若继续升高镀液温度，沉积速率却降低。
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