Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.
对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.
对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
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