Recently, numerous studies have been published on lead-free solders.
近年来人们已对无钎焊料进行了广泛的研究。
So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.
因此开展低成本无铅焊料润湿性和焊点电迁移研究非常有必要。
The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed.
文中介绍了三种典型无铅焊料体系的不足之处，以及银导电胶研究中的三个难题。
In combination of our recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合我们的研究成果，详细介绍了无铅钎料开发的现状及前景。
In combination of the recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合目前的研究成果，详细介绍了无铅钎料开发的现状及前景。
It has become an inevitable trend at home and abroad that lead-free solders were used in electronics, information and other fields.
焊料的无铅化，在国内外电子、信息等领域已成为必然趋势。
It is unavoidable that lead-free solders are applied in SMT field in view of the environmental protection and the competitive motivation.
无论是环境的要求还是作为竞争的筹码，无铅钎料在表面组装领域中的应用已经是不可回避。
The results indicated that small amount of high melting point metals had less than 2% effect on melting properties of previous lead-free solders.
结果表明，添加微量高熔点金属对焊料的熔融特性影响小于2%。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
In the process of lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.
在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。
However, many problems such as materials selection, soldering process and device, system compatibility are still obsessing the development and application of lead-free solders.
然而无铅化仍然存在材料、工艺、设备、系统兼容等问题。
Structures and materials used in lead-free wave soldering equipments were different from traditional wave soldering equipments due to characteristic of lead-free solders and fluxes.
无铅焊料和助焊剂的特性决定了无铅波峰焊设备在结构和材料选用上有很大不同。
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
With the increasing requirement of Lead-free electronics assembly, the patent problem on the alloy composition of Pb-free solders has also been greatly concerned.
随着无铅化电子组装需求的日益迫切，人们也越来越关注无铅焊料合金成分的专利问题。
With the increasing requirement of Lead-free electronics assembly, the patent problem on the alloy composition of Pb-free solders has also been greatly concerned.
随着无铅化电子组装需求的日益迫切，人们也越来越关注无铅焊料合金成分的专利问题。
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