The copper alloy strip of lead frame is the fundamental material for integrate circuit.
引线框架用铜带是集成电路的重要基础材料。
This paper discusses the methods for improving surface characters of semiconduc-tive lead frame.
研究探讨了改善半导体引线框架材料表面特性的方法。
The punching process of the lead frame was analyzed, the multi-position progressive die was designed.
分析了引线框的冲压工艺性，设计出了多工位级进模。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
A series of reliability experiments and analysis were operated on alloy and brass lead frame to compare their influences on components' performances.
为研究支架更替对器件性能和可靠性产生的影响，使用对比的方法，对合金支架和黄铜支架样品进行了一系列的可靠性试验和分析。
The lead frame structures of LET(light emitting triode)are much fine and with high yields, it is for high speed punch with very high precision and life.
发光三极管的引线框结构较为精细，产量很大，用高速冲床生产，对模具的精度和寿命要求很高。
The measures here put emphasis on improving tooling, control of the wearing parts, lead frame design and manufacturing and the way to select the material of lead frame.
重点对模具的改善、易损件的控制和框架设计制造及框架材料的选择等问题阐述了自己的见解。
The invention can effectively use metal silver, reduces the cost, improves the bonding force between plastics and the lead frame, and achieves the purpose of anti-layering.
本发明可以有效利用金属银，降低成本，提高塑料与引线框架的结合力，达到防分层目的。
The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure.
介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构，可供精密级进冲模设计参考。
The punching process of the lead frame was analyzed, the multi-position progressive die was designed. and the technology points of die design and manufacture were introduced in detail.
分析了引线框的冲压工艺性，设计出了多工位级进模。并详细介绍了模具设计制造的技术要领。
Photographs lead us to rethink, to realign the frame of our understanding.
摄影指引我们去重新思考，重新排列我们的认知框架。
This will lead to better stack tracebacks, as the frame pointer register is used as a frame pointer rather than a general purpose register.
这将产生更好的堆栈回溯，因为帧指针寄存器被用作帧指针而不是通用寄存器。
Failure to budget the appropriate items in a strategic time frame will under-utilize finances needed to achieve these sales goals and can lead to overspending in later months.
只有合理安排战略时间表中的项目预算，才能充分利用公司资金实现销售目标，并且避免在以后几个月出现超常支出。
This frame of mind breeds insecurity, In the song All the Way, one of my favorite Frank Sinatra tunes, Frank sings, "who knows where the road may lead us, only a fool would say." Listen to Frank.
这种心情会让我们心神不定，在我最喜欢的法兰克·辛纳屈的歌里有一首叫《AlltheWay》，他在里面唱道“谁知道这条路会将我们带往何处，只有傻子才说知道”。
Because Germany sunshine battery materials can't be absolutely pure, and positive plate metal, lead antimony alloy with the grid frame itself constitutes a battery pack.
由于德国阳光蓄电池材料不可能绝对的纯，且正极板与栅架金属(铅锑合金)本身也构成电池组。
Frame structure is one of the most structural forms in our country now, and frame structures may be take the lead in using cycled concrete.
框架结构是目前我国一般建筑结构应用最多的结构形式，也是再生混凝土可能率先应用的结构形式。
Experimental results show that different amounts of remaining (martensite) lead to different frame curves and hysteresis curves.
试验结果表明，拉伸曲线的骨架曲线与滞回曲线因为残余马氏体量不同而形状不同。
The correlation of the former's tone and the latter's position shows an obvious frame drift, which tells that microblog doesn't lead the public opinion but rather present it.
前者基调与后者立场之间的相关性呈现出明显的框架漂移，表明微博并未引导舆论而只是呈现了舆论。
The utility model can reduce the strength and speed of a descending welding head to a frame surface, and the utility model efficiently overcomes chip incline caused by poor back flowing of lead tin.
本实用新型可减缓焊头下降到达框架表面的力量和速度，有效地克服由于铅锡回流不良而引起的芯片倾斜。
It is especially pointed out that ignoring the effect of coupling the base frame and the foundation with the mast will lead to errors that are not acceptable in engineering.
强调指出，在这种振动分析中忽略底座与地基对井架振动的耦合作用，将导致工程上不允许的误差。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
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