However, the predominant process of secondary ion sputtering is kinetic sputtering, which closely related to the momentum deposition on the target surface (nuclear stopping power).
而主导二次离子溅射的过程是动能溅射，它与靶表面的动量沉积(核能损)过程密切相关。
The concepts of nuclear stopping power, electronic stopping power and average range were also introduced, the micrographs of unfilmed MCP and MCPs filmed with different thicknesses were shown.
给出了三代微光像管中微通道板离子壁垒膜对入射正离子阻止作用的描述，引进了核阻止本领、电子阻止本领和平均射程的概念。
The concepts of nuclear stopping power, electronic stopping power and average range were also introduced, the micrographs of unfilmed MCP and MCPs filmed with different thicknesses were shown.
给出了三代微光像管中微通道板离子壁垒膜对入射正离子阻止作用的描述，引进了核阻止本领、电子阻止本领和平均射程的概念。
应用推荐