ANSYS mechanical technology can be used to predict thermal, mechanical and moisture-driven stress and strain in a variety of package types.
在各种各样的封装类型中，利用ANSYS机械模块技术可以预测热力、机械和湿气引起的应力和应变。
The model can be used to predict the thermal and mechanical data such as temperature, strain, strain rate distributions.
应用该方法可以给出轧件变形过程中诸如温度场、应变场和应变速率场等各种热力结果。
The model can be used to predict the thermal and mechanical data such as temperature, strain, strain rate distributions.
应用该方法可以给出轧件变形过程中诸如温度场、应变场和应变速率场等各种热力结果。
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