• The SiC semiconductor device is fabricated by the method.

    碳化硅半导体器件捏造方法

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  • The result is the Torrent chip, a semiconductor device that analyses genomes.

    想法导致Torrent芯片,一种可分析基因半导体的诞生。

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  • It is a kind of storage device using semiconductor device as storage medium.

    半导体芯片作为存储介质存储器

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  • Optical disk device, semiconductor device, optical disk and recording method.

    光盘装置半导体器件,光盘记录方法

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  • The transient behavior of a semiconductor device of heat conduction is considered.

    考虑引导半导体设备中的传输行为

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  • Semiconductor device, and display device, driving method and electronic apparatus thereof.

    半导体器件显示器件,驱动方法及其电子装置

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  • During producing semiconductor device, it is prepared by evaporating to most of device leader.

    半导体器件生产过程中,器件引线大都镀的方法解决的。

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  • An active semiconductor device with three electrodes that may be either an amplifier or a switch.

    一种有源半导体器件三个电极可以放大器

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  • Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.

    方法半导体器件,丝焊的毛细管形成方法。

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  • Thyristor is a high-power semiconductor device, and the standard of its rated current is temperature.

    晶闸管属于大功率的半导体器件,决定允许通过电流大小标准之一温度的高低。

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  • The vertical multijunction semiconductor device (VMJ) has a good infrared photoelectric characteristic.

    重多重结半导体器件VMJ良好的近红外光电特性。

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  • A method of manufacturing a semiconductor device includes forming an insulation pattern over a substrate.

    一种制造半导体器件方法包括衬底形成绝缘图形

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  • Porous-film-forming composition, preparation method of the composition, porous film and semiconductor device.

    多孔形成用组合物,组合制备方法多孔半导体装置

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  • One aspect of the present invention is a method of forming a semiconductor device having copper metallization.

    发明方面形成具有金属化半导体器件方法

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  • This paper presents the building procedures of hydrodynamic model for submicron semiconductor device simulation.

    主要讨论亚微米半导体器件模拟流体动力学模型方程建立过程

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  • Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.

    半导体器件,半导体晶片芯片尺寸封装制作检测方法

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  • A method is provided for testing a semiconductor device that includes both a digital (310) and analog (320) portion.

    发明提供一种用于测试包含数字部分(310)模拟部分(320)两者半导体装置的方法。

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  • A semiconductor device may include a semiconductor substrate, one common gate electrode, and one gate insulating layer.

    半导体器件包括半导体衬底公共栅极电极栅极绝缘层

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  • Silicone resin modified polyester(SP) is a kind of ultra-pure surface protection material used in semiconductor device.

    聚酯改性SP用于器件表面保护高纯绝缘材料

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  • Voltage metering method, electric test method and device, and method for mfg. semiconductor device and device substrate.

    电压测量方法测试方法装置,半导体器件制造方法和器件衬底制造方法。

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  • Semiconductor device, semiconductor device manufacturing method, high carrier mobility transistor and light emitting device.

    半导体器件,半导体器件制造方法载流子迁移率晶体管发光器件。

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  • Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same.

    绝缘材料,绝缘膜用罩光清漆以及绝缘膜采用该膜或该清漆的半导体装置

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  • A memory cell and a data line are controlled with a reset signal, so that data can be reliably outputted in the semiconductor device.

    存储单元数据线复位信号来控制使数据半导体器件可靠地输出

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  • Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identify of the semiconductor device.

    半导体器件系统以及初始化检验半导体器件真实性身份方法

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  • Also provided is a semiconductor device including a gate structure having a larger width at the top of the gate than the bottom of the gate.

    并且本发明还提供了一种包括栅极结构半导体器件栅极结构栅极顶部宽度大于栅极底部宽度。

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  • A method is described for fabricating and antifuse structure (100) integrated with a semiconductor device such as a FINFET or planar CMOS devise.

    本发明提供了FINFET平面CMOS器件的半导体器件集成反熔断器结构(100)及其制造方法

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  • Porous membrane shaping composition, preparation method of porous membrane, porous membrane intercalation insulating film and semiconductor device.

    多孔形成用组合物,多孔膜制备方法,多孔膜、层间绝缘半导体器件

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  • Semiconductor device simulation has manifested its ever-increasing importance for the design of miniature devices in VLSI end new discrete devices.

    半导体器件模拟对于设计VLSI中的微小尺寸器件或者是新型半导体分立器件,都已越来越显得重要

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  • Transient excitation of a device followed by fourier decomposition is a calculating technique for finding the AC behavior of a semiconductor device.

    基于里叶变换瞬态激励一种模拟半导体器件交流特性计算技术

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  • Transient excitation of a device followed by fourier decomposition is a calculating technique for finding the AC behavior of a semiconductor device.

    基于里叶变换瞬态激励一种模拟半导体器件交流特性计算技术

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