The relation between the resistivity of conductive adhesive and the volume fraction of silver fillers was studied.
在电子工业中应用最广泛的导电胶粘剂是以银粉为导电填料以环氧树脂为粘合剂的体系。
The effects of silver particles morphologies and size on the electrical bulk resistivity of conductive adhesive were described.
从导电性角度考查银粉颗粒形貌和粒径大小对导电胶电阻率的影响。
In order to obtain better conductive functional filler and conductive adhesive, the surface of carbon nanotube (CNT) was wrapped by silver using chemical plating.
采用化学镀法在碳纳米管表面包覆金属银，从而获得了导电性极好的纳米银-碳复合管，并以该复合管为导电功能体制备导电胶。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
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