The manufacture of solder bump is one of the key technologies for area array packaging (AAP).
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.
另外，由于柱状块不熔化，半导体线路板和组装线路板之间的距离不因焊料而变窄。
Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.
另外，由于柱状块不熔化，半导体线路板和组装线路板之间的距离不因焊料而变窄。
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