Is the expiry date of the Solder Paste controlled?
是否对焊膏的有效期进行控制？
Equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
Do not use the other metal components contact solder paste.
勿使用其它金属成份接触锡膏。
Is the sequence of Solder Paste height measurements defined?
锡膏厚度的测量顺序是否指定？
The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。
This product is no-clean solder paste, very little residue, no cleaning.
本产品是免清洗焊膏，几乎无残留，无需清洗。
A solder paste used for brazing was developed and its technical performance was investigated.
研制了铝硬钎焊用钎料膏，对其工艺性能进行了研究。
Solder paste, screen printing, use ways, printing process course will decide the printing quality.
在锡膏印刷工艺中，锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
Full vision screen-printing with solder paste placement geometry inspection and measurement equipment.
具有焊膏放置几何形状检查和测量装置的满视觉丝印。
This test is with some resistors and NO solder paste - the reason the resistors are not staying in place.
这项测试是与一些电阻和没有锡膏- 电阻不到位停留的原因。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
The present invention relates to a solder paste composition used for precoating an electrode surface with solder.
本发明提供一种钎焊膏组合物，该组合物可应用于电极表面预涂钎料。
This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.
概述了低熔点和高熔点型无铅焊膏的开发动向。
For solder paste with more small particles introduced, shear-thickening appears before the onset of shear thinning.
当小尺寸焊料添加达到一定量时，在剪切变稀开始前出现剪切增稠现象。
Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder.
焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
The use of solder paste was simulated by solder paste mixer and the variation on appearance of solder paste was observed.
采用锡膏搅拌机模拟锡膏使用过程，观察锡膏状态随搅拌时间的变化。
The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality.
讨论了电子产品s MT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
Of greater value to the stencil designer is the area ratio, which can be related directly to eventual solder paste release.
对于钢网设计者来说非常重要的是面积比率。它直接与锡膏释放有关。
Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.
研究了焊粉粒度分布和氧含量对锡膏稳定性的影响。
The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.
文章从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005元件装配工艺技术。
X-RAY-ray inspection using a lead-free solder paste of voids issue, found that the size and diameter welded hollow in acceptable range.
使用X-RAY射线检测了无铅锡膏的焊接空洞问题，发现焊接空洞的大小和直径都在可以接受范围内。
The factors affecting soldering ability of rosin-based flux for lead-free solder paste, and the factors affecting erosion resistance are discussed.
实验结果表明，松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
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