When dipping tin. the tin cup in this machine raises automatically. An automatic wiper is provided to remove tin chips from tin bath.
沾锡时小锡杯会自动升起，锡面上锡屑并设计有自动排除干净之功能，使沾锡处无锡屑之情形。
For excellent float glass product view points of authors on formula, raw materials, melting, tin bath and control way were put forwarded.
为打造浮法精品，从配方、原料、熔化、锡退及控制方法等方面提出自己的观点。
Because different ingredient interferes each other while analysis the electroless tin bath, suitable analysis method should be found with the bath's character.
针对化学镀锡液成分分析过程中，各组分之间存在相互干扰的情况，需要根据镀液的自身特点寻找合适的分析方法。
"That's not a problem," replied Doris. "we have a tin bath out in the yard, and we bring it into the living room in front of the fire and fill it with hot water."
“那没问题，”Doris回答道，“院子里有个澡盆，咱们把它抬进外厅放在壁炉前，放满热水就能洗澡了。”
The existing bath analyzing methods are compared, as a result a quick and continous method for determining sodium hypophosphite and stannum(II) ion in electroless tin bath is determined.
并对现有的镀液分析方法进行了比较，确定了快速连续测定化学镀锡液中亚锡离子和次磷酸钠的方法。
The principle of intelligent power con - troller and its application to float glass line were introduced and the use of intelligent optimum pow - er splitting in heating control of tin bath.
介绍了智能调功器的原理及其在浮法玻璃生产线上的实际应用情况，并重点指出了智能优化功率分配在锡槽加热控制中的应用。
The effects of the composition and technological conditions of electroless tin preplating bath on the thickness and morphology of the coatings are investigated.
研究了化学镀锡预镀溶液的组成和工艺条件对镀层厚度和表面形貌的影响。
However, it suffers from some problems such as tin whisker, surface color changes and bath mudding.
但纯锡电镀中存在着许多问题，如锡晶须、镀层变色及镀液混浊等。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Tin-zinc alloy can be electrodeposited from the citrate bath containing additional agent 7880. Additive 7880 can make the deposit fine and bright.
在本文提出的柠檬酸盐配方镀液中能镀得锡锌合金镀层。添加剂7880可使镀层光亮并细化组织。
A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.
研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
The character of the tin-cobalt alloy coating, properties of the bath, influence of the impurities in the bath, troubleshooting and wastewater treatment are also studied.
研究了锡钴合金镀层的基本特性、镀液的性能、镀液中杂质的影响及故障处理和废水治理。
The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.
介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。
The effect of bismuth sulfate content in plating bath and current density on current efficiency, bismuth content and morphology of obtained tin-bismuth alloy was studied.
研究了镀液中硫酸铋含量和电流密度对镀层铋含量、电流效率及镀层表面形貌的影响。
A new technology that the tin-nickel-copper alloy deposition can be electroplated in the citrate acid system bath was introduced.
研究了一种柠檬酸盐体系电镀锡镍铜合金新工艺。
The compositions and controlling conditions of the bath, depositing mechanism and applications of electroless tin in fabrication of printed circuit boards in recent years are reviewed.
从化学镀锡液的基本组成、工艺特点、反应过程及应用等几方面简述了近年来化学镀锡在印刷线路板制备中的研究进展。
The compositions and controlling conditions of the bath, depositing mechanism and applications of electroless tin in fabrication of printed circuit boards in recent years are reviewed.
从化学镀锡液的基本组成、工艺特点、反应过程及应用等几方面简述了近年来化学镀锡在印刷线路板制备中的研究进展。
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