Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.
粗铝丝超声引线键合；换能器驱动电流；信号时频分析；特征提取；质量在线监测。
According to the circuit of ultrasonic wire bonding experiment platform, a piezoelectric transducer (PZT) driver signal acquisition circuit was designed.
根据超声引线键合实验平台电路结构，设计了PZT(压电陶瓷)驱动信号采集电路。
The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。
The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。
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