• 交联聚乙烯绝缘特性介电常数明确的高点

    PEX? Insulator features low dielectric constant for clearer highs.

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  • 综述制备uls I介电常数材料各种CVD技术

    Various CVD technologies for preparing low dielectric constant materials in ULSI circuits are summarized.

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  • 本文报道了一种新型纳米多孔低介电常数薄膜制备方法。

    A novel route to prepare low-dielectric constant mesoporous SiO_2 films is reported in this paper.

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  • 发明公开了一种用于制备介电常数电子玻璃纤维的玻璃组合物

    The present invention discloses a glass composition for preparing electronic glass fibre with low dielectric constant.

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  • 本文介绍了有关低介电常数材料薄膜制备方法基本特性的检测技术

    In this paper, we introduced the technologies used in preparation and test of low-dielectric-constant materials.

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  • 方法形成层间电介质具有介电常数显示出优良机械特性

    The interlayer dielectric film formed by the method has a low dielectric constant and shows superior mechanical properties.

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  • 间绝缘具有耐热性、高耐溶剂性、高透光率、介电常数各种优良的性能

    The layer insulation film has various excellent performances such as high heat endurance, high solvent resistance, high transmittance and low dielectric constant.

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  • 综述了介电常数介质薄膜制备方法结构性能表征工艺兼容性等领域的最新进展

    The synthesis, structure, properties and process interaction of low k dielectrics are reviewed. Characterization techniques for low k dielectric films are summarized.

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  • 为了实现更大带宽必须使用耦合条文很难实现尤其是介电常数

    In order to achieve larger bandwidth, it is necessary to use tight coupled sections which are difficult to realize especially high phase shift and low permittivity.

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  • 电流变具有介电常数固体微粒分散介电常数的绝缘液体所形成的一类稳定悬浮液。

    Electrorhological (er) fluids are formed with small particles of high dielectric constant dispersed in fluids of low electric fields.

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  • 开发损耗介电常数共烧陶瓷(LTCC)材料适合做微波mcm的基板材料

    The newly developed low loss, low dielectric constant and low temperature co fired ceramics (LTCC) materials are the best substrate for microwave MCM technology.

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  • 目前已研究使用过的介电常数烧结温度板材料及综合性能,流浆料有机添加剂进行了对比分析。

    The low sintering and low dielectrics substrate materials and their properties, and the organic additives for tape casting slurry are compared and analyzed.

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  • 分别介绍介电常数、中介电常数、高介电常数三类微波介质陶瓷的研究现状,探讨了微波介质陶瓷今后的发展趋势。

    The hypo-dielectric constant, middle-dielectric constant and hyper-dielectric constant, as well as their developing trend are also introduced.

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  • 磁带材料用于孔径耦合微带天线设计,利用其频率带抑制天线中激励的表面波,分别考虑介电常数介电常数的情况。

    The electromagnetic band-gap (EBG) materials is used to design the aperture coupled patch antennas, and both high permittivity and low permittivity materials are considered in this paper.

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  • 综述了采用成本常规FR - 4层压板芯材低介电常数高性能的半固化片形成的混合结构印制板,它具有较信号串扰和较的成本。

    This paper describes the hybrid-construction PCB were fabricated by the FR-4 laminate and high performance low-loss prepreg to achieve lower signal crosstalk and permit lower cost.

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  • 一定条件下该硝化具有较好的反应位置选择性,这一是由于反应介质介电常数,二是多孔载体也具有明显的作用。

    In this system good regioselectivity can be achieved mainly because of the existence of a porous support and the low dielectric constant of the reaction media.

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  • 酸钡具有介电常数的介质损耗等优异的性能,广泛地应用于电子工业中。

    Barium titanate (BaTiO3) is a well-known ferroelectric material with high dielectric constant and low losses above room temperature, and it is extensively used in the electric industry.

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  • 无机材料相比聚全物材料具有较大的电光响应破坏阚值介电常数并且容易加工成形

    Compared to inorganic materials, polymeric materials have larger electro-optical response, lower dielectric constant, and higher damage threshold, and are easier to be processed.

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  • 无机材料相比聚全物材料具有较大的电光响应破坏阚值介电常数并且容易加工成形

    Compared to inorganic materials, polymeric materials have larger electro-optical response, lower dielectric constant, and higher damage threshold, and are easier to be processed.

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