• 高频振动去除亚微米颗粒即刻损坏晶圆

    High frequency vibration removes submicron particle instantly without damaging wafers.

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  • 本文综述了亚微米光刻纳米光刻技术。

    In this article, deep submicron lithography and nano processing are reviewed.

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  • 测量精度亚微米量级。

    The measurement accuracy was sub-micron grade.

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  • 介绍一种新的亚微米发射极窗口刻蚀工艺

    This paper introduces a novel submicron etching technology for emitter window.

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  • 随着亚微米技术串扰噪声问题越来越严重

    With deep submicron technology, crosstalk noise becomes more and more serious.

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  • 报道远紫外准分子激光进行微米光刻实验结果

    Experimental results of deep submicron lithography with a excimer laser are reported in this paper.

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  • 并给出紫外光微米级图形电镜扫描照片结果

    The results of electronic microscope scanning of sub-micrometer patterns by far ultraviolet lithography are given.

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  • 亚微米器件载流子效应(hce)进行了研究

    The hot carrier effects (HCE) in deep sub-micron devices has been studied.

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  • 微米树脂吸附反应快速反应,离线取样分析困难。

    The process of submicron resin adsorption is a kind of rapid reaction, so it is difficult to monitor.

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  • 方法位移分辨力微米量级,具有较高测量精度

    The proposed approach has a high precision since the vibrating displacement is measured at submicrometer resolution.

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  • 结果表明,该超分级机用于微米亚微米粉体分级。

    The classifier can be used for classifying powders of micron or submicron size.

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  • 微米垂直墙的制备垂直硅薄膜耦合约瑟夫逊结的关键工艺。

    The fabrication of submicron vertical silicon screen is a key step for fabricating Josephsonjunction coupled by vertical silicon membrane.

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  • 最后论证光束激光系统制作亚微米光栅型光板可行性。

    At last, the feasibility of fabricating light guide plate by double beam laser direct writing system is confirmed.

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  • 建立了一组装亚微米聚苯乙烯球的方法,称作蒸发组装法。

    Evaporation self-assembly method, which is used to assemble sub-micrometer polystyrene microspheres, is presented in this paper.

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  • 随着微米工艺广泛应用,瞬态故障成为芯片失效主要原因

    Since deep submicron manufacturing process is widely used in microprocessors, transient faults have become the main source of chip faults.

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  • 实验表明算法软件实现可以将像点位置坐标提高微米

    The experiment shows that realizing the algorithm can improve the accuracy of image's coordinate to sub-micro level.

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  • MEMS大量使用薄膜材料,厚度可微米微米直至纳米量级。

    Thin films are widely used in MEMS with different thicknesses from micron, sub-micron to nanometer scale.

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  • 亚微米集成电路互连线延迟设计十分重视必须解决的问题

    Interconnect wire delay is a very important question that must to be resolved in deep submicron IC design.

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  • 光刻校正技术已成为亚微米集成电路设计制造关键技术

    The optical lithography correction techniques become key technologies in the IC designing and manufacturing of VDSM.

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  • 激光散射研究液体高分子亚微米颗粒动态行为有效方法之一

    Laser light scattering is one of the most efficient approaches exploring the dynamics of polymer and sub-micrometer particles in liquid.

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  • 晶粒依靠生成微米微米级的铁素体,使钢强度韧性大大提高

    The strength and toughness of super fine grain steels are greatly increased because of its micrometer or sub micrometer grade grain size.

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  • 该方法采用边界路径匹配”技术,使位移量检测精度达到了微米级。

    Sub-micron accuracy of displacement detection is obtained by adopting edge fitting technology and path matching technology.

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  • 实验结果表明基于激光莫尔信号精密定位装置获得亚微米平面定位精度

    The experimental results show that submicron level plane positioning accuracy can be achieved by the precision positioning device based on laser Moire signal.

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  • 特征尺寸进入到微米微米量级时,需要克服极限束缚增加器件集成度

    When the characteristic size reach micron, submicron degree, overcoming the "limit" binding in order to increase the integration of device.

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  • 微米级单分散颗粒实现三维有序聚集组装胶体晶体制备光子晶体方法之一。

    One of the effective ways to fabricate photonic crystal is the method of self-assembly: obtaining colloid crystal from sub-micrometer colloidal spheres.

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  • 本文湍流粉碎机研究对象,利用该机制取了几种材料亚微米超细粉体。

    Pulverizer of turbulence was researched in this thesis, by which several materials submicron superfine powder were prepared.

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  • 在此基础上,提出反应沉淀法制备亚微米粒子过程中颗粒粒度及粒度分布控制方法

    The influences of these factors and the method for controlling particle size distribution were presented for the reaction precipitation process.

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  • 针对微米工艺版图设计存在时序收敛问题,提出区域约束版图设计方法。

    A new method for layout design based on region constraints was presented to resolve the timing closure problem of physical design in deep sub-micron technology.

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  • 亚微米纳米级半导体技术迅速进步,使得集成电路设计已经进入系统集成芯片时代

    The rapid progress of semi-conductor technology on deep sub-micro and nanometer scale announces the SOC era of IC design.

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  • 运动增量编码器(IME)一种新型轴心轨迹测量传感器测量灵敏度可以达到亚微米级。

    Incremental motion encoder (IME) is a new type of transducer for shaft center trace measurement with resolution up to sub-micro.

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