息 中文名: 镀铜药水 英文名: Copper-plating solution 危险品类别: 毒害品和感染性物品 危险品项目: 毒害品 危险货物编号: 61002 设为首页 | 加入收藏 | 联系我们 | 网址加盟
基于18个网页-相关网页
cyanide copper plating solution 氰化镀铜 ; 氰化
acid copper plating solution 酸性镀铜液
acidic-copper plating solution 酸性镀铜液
sulfate copper plating solution 酸性镀铜液
The component data of pearl nickel, bright nickel, acidic copper and brass plating solution in production were analyzed when the best result of the plating deposit obtained.
为了获得电镀的最佳结果，在生产中对珍珠镍、光亮镍、酸性铜和黄铜四种镀液的成分参数进行了统计分析。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
ATS ADDCOPPER CT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.
因此，用钯导电体层形成溶液将工件转变成导体，所述溶液是中性的，不使用高碱性无电镀铜溶液。
应用推荐