... 铜缆分布式数据接口 Copper Distributed Data Interface CDDI 镀铜 Copper Electroplating 协处理器 Co-processor ...
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(二)电镀材料 3D IC 填充孔洞的主要方式是铜填充，需要的材料为铜电镀液(Copper Electroplating) 及相关之化学添加剂(Additives)包括平整剂(Leveler)、促进剂(Suppressor)及加速剂 (Accelerator)，其材料配方的比例及如何减少空...
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石墨纤维表面电镀铜工艺研究 关键词：石墨纤维；氧化处理；电镀铜 [gap=962]Keywords：graphite fiber；oxidation treatment；copper electroplating
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A new copper electroplating bath is found. MN(M、N、SPS、PE) and its substituent technics are researched by the Hull Cell Test.
本课题的目的在于研究无染料酸性镀铜的工艺新配方。
参考来源 - 无染料酸性镀铜工艺的研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The matellization process of blind via or though hole is also achieved by means of copper electroplating.
盲孔或通孔的属化制程也是直接用电镀的方式完成。
The process of cyanide copper electroplating is replaced by the proposed process of pyrophosphate electroplating copper on magnesium alloy.
用研究的焦磷酸盐镀铜工艺代替氰化镀铜工艺作为过渡铜镀层的无氰镀工艺。
Copper electroforming and nickel electroforming processes were compared with copper electroplating and nickel electroforming process respectively.
对电铸铜与电镀铜工艺、电铸镍与电镀镍工艺进行了比较。
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