The mechanism of electroless plating tin was investigated from displacement process and reduction process.
对化学镀锡的机理从置换过程和还原过程两个方面进行研究。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
应用推荐