本文报道了一种新型纳米多孔低介电常数薄膜的制备方法。
A novel route to prepare low-dielectric constant mesoporous SiO_2 films is reported in this paper.
综述了低介电常数介质薄膜的制备方法、结构与性能表征、工艺兼容性等领域的最新进展。
The synthesis, structure, properties and process interaction of low k dielectrics are reviewed. Characterization techniques for low k dielectric films are summarized.
本文介绍了有关低介电常数材料薄膜的制备方法和基本特性的检测技术。
In this paper, we introduced the technologies used in preparation and test of low-dielectric-constant materials.
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