本发明属固化剂技术领域，具体为一种新型环氧树脂组合物。
This invention is a neotype ethoxyline resin compounds, and it's belongs to curing agent technological field.
文章对日本近年在高性能PCB基板材料用新型环氧树脂的品种、性能及应用进行了阐述。
Recent variety, performance, application of Japanese new epoxy resin used in high performance PCB base material were reviewed.
可合成拥有优异热稳定性、阻燃特性和物理机械性的新型含磷环氧树脂。
It may be used for new phosphorus-containing epoxy resins, with excellent heat stability, fire-retardant and physical-mechanical property.
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