...选择两种或多种不同的材料按照一 定的比例以某种特定的方式复合起来(materialcomposition),或是材料集成 (material integration),即在所使用的材料构件埋入某种功能材料或器件,使这 种新组合材料具有某种或多种机敏特性甚至智能化。
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晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
制造集成电路需要将如半导体和金属等多层材料放置在硅片上。
Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.
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