适用于PC b板含浸过程中遮蔽金手指部分和防止电镀液浸入及污染。
Used in the masking operation during wave solder process on PCB, prevented electroplating liquid immersing and polluting.
电镀期间，依据电解原理，将表盘浸入带有电流的液缸中若干次。
During electroplating, based on the principle of electrolysis, dials are immersed into several successive baths through which an electric current is run.
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