... LAPM Link Access Procedure for Modems 用于调制解调器的链路访问规程 lapped face 研磨表面 lapping compound 研磨剂 ...
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表面可以改变您的创作之前，通过研磨，喷砂，抛光，抛丸或具有覆盖。
The surface can be changed before your creation by grinding, sandblasting, polishing, shot blasting or with an overlay.
锥度研磨：研磨锥度表面的工艺，很大程度上依赖于蓝图的设计规范。
TAPER GRIND: Grinding process which produces angled surfaces, may be intentional or unintentional depending on blueprint specifications.
分析了不同加工参数对被加工内圆表面粗糙度和研磨量的影响。
Effect of different machining parameters upon the inner surface roughness and the removal rate was analyzed.
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