结果表明：采用含氨溶液预处理除铜，有效地排除了铜对氰化浸金的影响。

Test results showed that use of ammoniacal solution pretreatment can effectively remove copper, and thus alleviating negative effect of copper on leaching of gold.

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恒电流状态下，在氨硫酸盐-氯化物溶液中的铜基片表面进行电沉积，获得了具有5种不同成分的镍钴弥散合金镀层。

The nickel and cobalt disperse alloy deposits of five different compositions were obtained by electrodeposition on Cu substrates in the galvanostatic regime from an ammonium sulfate-chloride solution.

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