For example, as shown in FIG. 8a, an oxide layer 810 optionally is patterned on a silicon substrate 820.
例如,如图8a所示,氧化层810选择性地在硅衬底820上形成图案。
It combines an Au microelectrodes array (AuMEA) with two light-addressable potentiometric sensors (LAPS) on a silicon substrate.
系统由一个电化学微电极阵列和两个光寻址电位传感器组成。
The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole.
该硅晶片包括硅基材、绝缘层、至少一电性元件及至少一穿导孔。
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