The machining technology of polished ceramic tile and the course of its polishing line have been introduced in this paper, especially the procedure of edge grinding and surface planing.
介绍了陶瓷抛光砖的加工工艺，以及目前陶瓷砖抛光线上的磨边机和刮平定厚机的基本情况。
In this paper, the surface microstructure of the polished ceramic tile is investigated by opticmicroscope and scanning electron microscope.
采用光学显微镜、扫描电镜等对抛光砖的表面显微结构进行了研究。
The sintering of the tile is suited to the sintering technology with a large adjustment of addition proportion of the breakage sanitary-wares, polished tile, ceramic tile and polished-tiles debris.
依此方案生产透水砖，陶瓷破损料和陶瓷废料的加入量最多可占到75%，在较大范围内调整破损洁具、 抛光砖、瓷片和抛光砖磨屑间的加入比例也可以适应烧成工艺。
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