Copper was reduced by formaldehyde which was contained in the effluent of chemical copper plating, and EDTA in the effluent was reclaimed after acidify.
探讨了利用原化学镀铜废液中的甲醛将铜还原，后酸化回收EDTA的新工艺。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
ATS ADDCOPPER CT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated.
研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。
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