化学气相沉积(chemical vapour deposition CVD) 一种高熔点金属的气态化合物和还原气体在气相中直接发生还原反应时，所得的高熔点金属便会聚集成金属粉末。
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Coating by physical vapour deposition (PVD), coating by chemical vapour deposition (CVD) and surface layer modification by ion implantation, all three are being tested and are partly in use.
涂层的化学气相沉积(CVD)和表面层改性的物理气相沉积(PVD)涂层的离子注入，所有三个正在受到考验，并部分使用。
This paper mainly introduces application of chemical vapour deposition (CVD) technology to the cold-drawn dies and relevant methods to make dies by using this technology.
本文主要介绍化学气相沉积(CVD)技术应用于冷拔模具以及采用该技术的模具在制作过程中的几个问题。
Several methods are used in preparation of FTO, which include chemical vapour deposition (CVD), sputtering, thermal evaporation and sol-gel technique.
已经有几种方法用于制备FTO薄膜，包括气相沉积法（CVD）、溅射、热蒸发法、溶胶凝胶法。
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