In this paper, we describe filtration methodology and approaches for new generation CMP slurries.
叙述了新一代CMP浆料的过滤工艺和方法。
Typical results from these tests show that filtration of newer ceria and alumina, and historic silica CMP slurries is beneficial in managing large particles.
由这些测试的典型结果现实，更新的氧化铈和氧化铝以及固有的二氧化硅CMP浆料的过滤有利于大颗粒的控制。
The use of different barrier slurries for copper chemical mechanical planarization CMP creates a challenge for post-CMP cleaning.
铜化学机械平面化不同阻挡层浆料的应用引起了铜CMP后清洗的问题。
应用推荐