... CLCC ceramic leaded chip carrier 带引脚的陶瓷芯片载体 COB chip on board 板上芯片封装 DFP dual flat package 双侧引脚扁平封装,是SOP 的别称 ...
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COB Chip-on-Board Technology 板载芯片技术
The finite element method was used for analysis of heat stress in chip on board (COB).
本文采用有限元法分析了板上芯片(COB)的热应力分布。
The finite element method was used for analysis of heat stress in chip on board(COB).
本文采用有限元法分析了板上芯片（COB）的热应力分布。
According to the release, "Super Talent achieves maximum miniaturization in the Pico series, renowned as one of the world's tiniest USB families, by using chip-on-board (COB) technology."
根据新闻稿， “超级人才达到最大的小型皮系列，被誉为是世界上最小的USB接口的家庭，通过使用芯片板（棒）技术。
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